Circuit board manufacturing - 企業ランキング(全18社)

更新日：Nov 05, 2025 集計期間:Oct 08, 2025〜Nov 04, 2025
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会社名	企業情報	代表製品
会社名	企業情報	製品画像・製品名・価格帯	概要	用途/実績例
ウイル	所在地 Osaka/ 事業内容 ■Printed Circuit Board (Main Product) The following are development products, etc. ■LED Products (Made in China) ■UV Sterilizer ■Iro... 主要取引先	Manufacturing of stack build-up substrates (6-layer substrates, 8-layer substrates, 10-layer substrates) Other	【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum Line/Space: 0.075mm (3mil...	Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power sup...
		Manufacturing of printed circuit boards COB boards (electroless gold plating and electroplated gold plating) Other	【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum L/S: 0.075mm (3mil) ■ Min...	Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power sup...
		Manufacturing of printed circuit boards and thermal head boards (sensor boards). Other	【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum L/S: 0.075mm (3mil) ■ Min...	Communication devices, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power suppl...
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ウイル

所在地

Osaka/

事業内容

■Printed Circuit Board (Main Product) The following are development products, etc. ■LED Products (Made in China) ■UV Sterilizer ■Iro...

主要取引先

代表製品

Manufacturing of stack build-up substrates (6-layer substrates, 8-layer substrates, 10-layer substrates)

概要

【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum Line/Space: 0.075mm (3mil...

用途/実績例

Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power sup...

Manufacturing of printed circuit boards COB boards (electroless gold plating and electroplated gold plating)

概要

【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum L/S: 0.075mm (3mil) ■ Min...

用途/実績例

Communication equipment, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power sup...

Manufacturing of printed circuit boards and thermal head boards (sensor boards).

概要

【Manufacturing Capability Values】 ■ Production Boards: 1 to 48 LAYERS ■ Board Thickness: 0.10mm to 3.2mm ■ Minimum L/S: 0.075mm (3mil) ■ Min...

用途/実績例

Communication devices, sensors, UPS equipment, beauty-related devices, consumer products, automotive-related, electric bicycles, power suppl...
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所在地

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事業内容

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Circuit board manufacturing - 企業ランキング(全18社)

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